Overview

Model 616B-005 thermosonic single channel peg bonder has been designed to perform thermosonic attachment of insulated or bare wire / ribbon.
 
This unit contains a built-in in temperature controller.
 
Applications include hard disk head stack assemblies, head gimbal assemblies, microwave, sensor circuits, ball coining, flex-on-flex, ribbon tacking, pin-tab bonding, and mesh bonding.

Standard Features

• Hybond Soft Touch energy system
• Motorized Z axis control
• 1.5 inch vertical bonding window
• Variable height bonding within 1.5 inch
• Built-in temperature controller
• Search height adjustable in 0.001 inch increments
• 0-900 mSec bond time
• Wiring for 120 VAC 50/60Hz @ 10A Max.
• Optional Features
• Leica Stereo Zoom microscope (OP-06S6T)
• Nikon SMZ660 microscope (OP-06A)
• Dual fiber-optic illuminator (OP-08A)
• 240 VAC 50/60 Hz input wiring (OP-12)
• Bonder capability for vacuum pick & place (OP-47)
• 8:1 X-Y Manipulator (OP-30)
• Pick-up / Bond Tool (BLDBT-X) used with OP-47
• Peg Tool (PT-X.X)

Optional Features

Specifications

» Ultrasonic System: PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
» Ultrasonic Power Range: 0-2 watt on Low setting, 0-4 watts on High setting
» Bond Time Range: 0 - 900 mSec
» Bond Force Range: 12 - 300 grams (higher force available)
» Bondable Wire Diameters: 0.5 to 2.0 mils (12,5 to 50 µm) insulated ; 0.5 to 2.0 mils (12,5 to 50 µm) bare
» Bondable Ribbon Dimensions: 1 x 20mils (25 x 500µm)
» Bondable Wire /Ribbon Materials: Gold, gold plated copper, and aluminium
» Bond Head Movement: True vertical motorized movement
» Bond Actuation: Sensor at variable height, actuated by pushbutton or footswitch
» Z Axis Travel: 1.5 in (3,81 cm)
» Vertical Bonding Window: 1.4 in. (3,55)
» Table Motion: 4:1, manual
» Input Power Requirements: 120 VAC 50/60 Hz @ 10A (std) or 240 VAC 50/60 Hz @ 5A
» Minimum Bench Space Required: 20" x 20" (50,8cm x 50,8cm)
» Unit Weight /Shipping Weight: 45 / 135 lbs (20,41 / 61,24 Kg). Shipping weight will vary.
» Industry Standards: CE certified