FM-903 is normal type semi-automatic wafer mounter up to 8 inch(200mm) size of work.Automatic operation means the operator is required only for loading and unloading workpieces. This contributes to stable tape and film application work and greater yield.

Uses

• For dicing process
• For DAF (die-bonding film)
• For back grind (BG) film

Features

• Compatible with general adhesive tape and blue tape
• Compatible with UV tape
• Variable application pressure
• Variable application speed
• Automatic balancing function for application roller
• Can be customized for non-contact surface application
• Can be customized for hot wafer chuck
• Can be customized for measures against static electricity
• Can be customized to meet other user specifications