Wafers require carefully handling to ensure narrow streets and prevent edge chipping after dicing. The TEX Series of Die Matrix Expanders evenly expands/separates wafers in the X and Y directions so that streets cross all chips. This eliminates waste issues and facilities chip pickup in such a way that makes mounting in die-bonding processes smoother. Technovision has provided a variety of die matrix expander, you can select it depending on your requirement from the basic model, low expansion expander, motor drive expander, auto-cut expander etc. After expansion, separated wafer on the tape retain the expanded state by Grip rings(pinching of the outer ring and the inner ring).

Features

• Expansion ratio can be varied as necessary.
• Expansion speed can be varied.
• The heated expansion stage is helpful for high-ratio expansion.
• Expanded film and wafers can be gripped automatically.