Description

Equipped with a black light as the light source for curing, this low-cost model is ideal for R&D and low volume production of wafers up to 200 mm (8″).

With the light source arranged so as to produce high density, the system provides uniform curing.

This black light UV curing system has the same functions as the high-pressure Hg lamp model, including the irradiation timer, the N2 purge function to protect the curing performance from the influence of oxygen, and the safety devices.

Supporting wafers up to 200 mm (8″)
Model: UVB-608
Dimensions: 455(W)×520(D)×245(H)