Description

This model was developed for both pre-cut and normal tape.

The industry’s first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the following uses

Mode FM-6643 : 300mm(12 inch) semi-automatic wafer mounter

Mode FM-6648 : 200mm( 8 inch) semi-automatic wafer mounter

Features

1. User-settable parameters, including application pressure, speed, and temperature
2. Variable application pitch for normal tape
3. Tension-free application
4. Bubble-free application
5. Can be customized for non-contact surface application
6. Equipped with measures against static electricity
7. Compact, light-weight, and small-footprint type

Uses

1. For dicing process with both pre-cut and normal tape
2. For dicing process with pre-cut tape only
3. For dicing process with normal tape only
4. For precut two-layered tape (DAF with dicing tape)
5. For normal two-layered tape (DAF with dicing tape)
6. For single DAF tape
7. For back grind (BG) film
8. For front-protection film
9. For rear-protection film
10. For functional film (resist film, CSP film sealings, underfill film, and others)