Features

1. High adhesion prevents wafer breakage caused by delamination of tape due to lack of tackiness.
2. Hardness of backing film and adhesive is controlled to optimize shock and vibration absorption.
3. Strong resistance to acid etchants makes it possible to eliminate resist-process.
4. Characteristics of near zero adhesion after UV irradiation eliminate possibility of residues and wafer breakage.
5. Consisting of strictly selected raw materials, contains little impurities and provides virtually no contamination.