Description

Features

• Heat resistant up to 290°C * 5 minutes
• No residue & stains
• Easy removal and no damage to the substrate surface
• Good thermal stability
• Customizable with Anti-static resistant
• Die-cut converting process friendly

Application

• Leadframe masking, PCB masking, PCB reflow, Package protection, Sputtering, Wave soldering, Solder reflow, Advanced substrate masking. Other high temperature processes.