Hibex

Fully Auto Ring Frame Remover

Fully Auto Ring Frame Remover

Fully Auto Ring Frame Remover

CUON Solution Co., Ltd

This wafer remover system automates the removal of the protection tape after mounted wafer.

Extra features:

Peel bar angle adjustable

Chuck surface cleaning function

Removal Tape

Porous remove chuck

Description

Specification

Application wafer : 6″, 8″ or 8″, 12”

Application tape : Non-UV & UV Tape

UPH : 45 wafer/hr (8″),  40 wafer/hr (12″) [Based on remove speed 50 mm/s UV time 5 sec]

Main controller : PLC

Data & GUI : PC

Blade life time : 500 sheets

Wafer center accuracy : +/-0.5mm

Chuck temp : 60℃ +/-5

Tape Tension Controller: Yes

UV Irradiation specification:

  1. 365 nm wave
  2. High pressure mercury lamp
  3. 100~1000 mj/㎠ dosage
  4. Lamp life time 1000 hr
  5. Ring blower
  6. UV sensor

Options (Add-Ons)

  • HEPA filter
  • GEM interface

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