Description

Specification

Application mold size : 300/600 mm

Application warpage : Less than 6 mm

Warpage reduction: Less than 1~2 mm

UPH: 50 wafer/hr

Heating: 30 seconds

Cooling: 20 seconds

Main system control : by PLC (Omron)

Data & GUI : by PC

Operation: 10″ touch monitor

EMO : 4 ea

ESD: 1000V => 100V (within 5 seconds)

Ion balance: +/- 50V

Options (Add-Ons)

• Warpage measuring function
• Integrated with other equipment