Epoxy Mold Compound dispensing machine

This machine is designed to dispense Epoxy Mold Compound to metal carrier uniformly for mold chase process.

Features:

Real-time monitoring of dispense quantity

Operation via manual

Load cell installation and weight scale

Description

Specification

Application carrier : 8″ & 12”

Dispense accuracy : +/- 5% from target weight

Throughput: 300mm panel at 70 grams per panel

Dispense rate: Programmable dispense rate from 2 gram to 500 gram minutes (Resolution: 0.5)

Hopper capacity: 10 litter (7kg)

Noise level : 80 dB

Options (Add-Ons)

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