Wafer Macro / Micro inspection machine

This machine is designed to inspect wafer pattern or backside with wafer thickness or warpage Measurement.

Description

Specification

Application carrier : 8″ and 12”

Application cassette : FOUP, FOSB, DSC, Special cassette

Main system control : by PLC (Omron)

Data & GUI : by PC

Tower lamp : 4 colors(R, Y, G, B)

EMO : 2EA

Throughput : 80~100 wph/hr

Noise level : 80 dB

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