Description

Overview

The 522A-40 incorporates Hybond’s exclusive Soft Touch™ force ramping system that bonds effectively even to sensitive materials.

Superior wire control is provided by a motorized feed system which features front panel operator adjustment of tail length.

Model 522A-40 sets the industry standard for ease of operation and maintenance. Front panel operator controls include force, ultrasonic time, ultrasonic energy, tail length, EFO power, and stage heat.

The 4:1 X-Y manipulator stage movement and Z axis bond motion are conveniently located to reduce operator fatigue.

Precision machined mechanical components with sealed ball bearings at major points are durable and trouble-free. Modular electronics facilitate quick and cost-effective maintenance.

Standard Features

• Hybond Soft Touch energy system
• Independent Z-axis lever for bonding tool control
• Motorized vertical wire feed
• 1-2-2 stitch capability
• 0.5 and 2 inch spool mounts
• Loop height control adjustment
• Electronic ball size control
• Swing-away wire clamp assembly
• Deep vertical access of 0.53 inch
• Long horizontal reach of 6.5 inches
• High and Low EFO power
• Independent control of 1st & 2nd bond parameters
• Tail length adjustable
• Audio & visual bond sequence fault indicators
• 10 x 12 inch work platform
• LED display of work stage temperature
• Infinite angle microscope mounting
• Front panel ultrasonic test button
• Comfortably fits 10 x 10 inch module or substrate

Optional Features

• Leica Stereo Zoom microscope (OP-06S6T)
• Nikon SMZ660 microscope (OP-06A)
• Dual fiber-optic illuminator (OP-08A)
• 240 VAC 50/60 Hz input wiring (OP-12)
• Bump Bonding Capability (OP-13)
• 8:1 X-Y manipulator (OP-30A)
• High & low ultrasonic power (OP-44)
• 2.125″ diameter heated workstage (WST-15A)
• 4″ x 4″ heated workstage (WST-19B)
• 10″ X 6″ heated workstage (WST-65)

Specifications

» Ultrasonic System: PLL self-tuning, 62.5 KHz (±2.5KHz) nominal             
» Ultrasonic Power Range: 0-1 watt on Low setting (default), 0-2 watts on High setting
» Bond Time Range: 10 – 400 mSec
» Bond Force Range: 15 – 150 grams
» Temperature Control Range: Ambient to 250° C
» Bondable Wire Diameters: 0.7 to 2.0 mils (18 to 50,8 µm)
» Bondable Wire Materials: Gold wire
» Bonding Capillary Length: 0.750″
» Bond Head Movement: Manual
» Bond Actuation: Switch at fixed height, actuated by lever
» Z Axis Travel: 0.5 in (1,20 cm) maximum
» Vertical Bonding Window: 60 -100 mils (152-254 µm) max dist. between 1st & 2nd bond
» Table Motion: 4:1, manual
» Input Power Requirements: 120 VAC 50/60 Hz @ 10A (std) or 240 VAC 50/60 Hz @ 5A
» Minimum Bench Space Required: 20″ x 25″ (50,8cm x 63,5cm)
» Unit Weight /Shipping Weight: 70 / 150 lbs (50,8 / 63,5 Kg). Shipping weight will vary.
» Industry Standards: CE certified