Description
Non-haloganated BT Materials
These are halogen free materials for PWB use. The halogen free materials achieve a flammability rating of UL94V-0 without using halogens, antimony, or phosphorus compound. The substitution of an inorganic filler as the flame retardant, has the additional benefits of improving the small hole CO2 laser drilling properties, and lowering the CTE.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-HL832NX
Type A |
GHPL-830NX
Type A |
0.06, 0.1, 0.15, 0.2-0.8(0.1step), 0.25, 0.35, 0.45mm | 0.03, 0.035, 0.04, 0.045, 0.05, 0.06, 0.07, 0.1mm |
Features
CCL-HL832NX Type A / GHPL-830NX Type A is a halogen free BT material for IC plastic packages. Its properties are essentially the same as those of the thin IC package material CCL-HL832HS / GHPL-830HS.
Typical applications
Fully Green IC packages.
Non-haloganated Low CTE BT Materials
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-HL832NS
|
GHPL-830NS
|
0.04,0.05,0.06,0.1,0.15, 0.24,0.25,0.3,0.4(0.1step), 0.46mm |
0.025,0.03,0.035,0.04, 0.045,0.05,0.06,0.1mm |
Features
Low CTE and low shrinkage, effective to reduce the warpage of substrate for IC PKG
Superior heat resistance after moisture absorption because of low moisture absorption
30microns copper clad laminate and 25microns prepreg are available
Typical applications
Substrates for CSP,FC-PKG,BGA,PGA
| Item | Condition | Unit | HL832NX (A) |
HL832NS | HL832NS typeLC |
HL832NS typeHD |
|
|---|---|---|---|---|---|---|---|
|
Dielectric Constant
|
|||||||
|
1GHｚ
|
－
|
4.9
|
4.4
|
4.0
|
4.3
|
||
|
5GHｚ
|
－
|
4.8
|
4.3
|
3.9
|
4.2
|
||
|
10GHｚ
|
－
|
4.7
|
4.3
|
3.9
|
4.2
|
||
|
Dissipation Factor
|
|||||||
|
1GHｚ
|
－
|
0.011
|
0.006
|
0.006
|
0.006
|
||
|
5GHｚ
|
－
|
0.011
|
0.008
|
0.007
|
0.008
|
||
|
10GHｚ
|
－
|
0.012
|
0.008
|
0.008
|
0.008
|
||
|
Insulation Resistance
|
C-96/20/65
|
Ω
|
1015-16
|
1015-16
|
1015-16
|
1015-16
|
|
|
Surface Resistance
|
C-96/20/65
|
Ω
|
1015-16
|
1015-16
|
1015-16
|
1015-16
|
|
|
Volume Resistivity
|
C-96/20/65
|
Ω・cm
|
1015-16
|
1016-17
|
1016-17
|
1016-17
|
|
|
Flexural Strength
|
MPa
|
450
|
490
|
750
|
480
|
||
|
Flexural Modulus
|
GPa
|
28
|
27
|
30
|
26
|
||
|
Tensile Strength
|
MPa
|
270
|
290
|
400
|
310
|
||
|
Young’s Modulus
|
GPa
|
28
|
27
|
30
|
26
|
||
|
Glass Transition Temp.
|
DMA
|
℃
|
230
|
255
|
255
|
255
|
|
|
TMA
|
℃
|
200
|
230
|
230
|
230
|
||
|
DSC
|
℃
|
190
|
210
|
210
|
210
|
||
|
Cofficent of Thermal Expansion
|
X,Y
|
α1
|
ppm/℃
|
14
|
10
|
7
|
10
|
|
X,Y
|
α2
|
ppm/℃
|
5
|
3
|
3
|
3
|
|
|
Peel Strength
|
12μm
|
KN/m
|
0.85
|
1.0
|
1.0
|
1.0
|
|
|
Flame Resistance
|
E-168/70
|
－
|
V-0
|
V-0
|
V-0
|
V-0
|
|
|
Density
|
g/cm3
|
2.1
|
1.9
|
1.9
|
1.9
|
||
|
Heat capacity
|
J/g・K
|
1.00
|
1.00
|
0.95
|
0.95
|
||
|
Poissin’s ratio
|
－
|
0.19
|
0.18
|
0.18
|
0.18
|
||
|
Moisture absorption
|
85 ℃/85RH% 168h
|
%
|
0.44
|
0.31
|
0.30
|
0.31
|
|
- *MGC also has halogen free materials, CCL-HL820, CCL-HL820W, and CCL-HL820WDB.
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