Description
BT Materials for High Speed IC Plastic Package
These materials excel in dielectic properties and they are suitable for IC plastic package such as high frequency devices.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832MG | GHPL-830MG | 0.06, 0.1, 0.13 0.15, 0.18, 0.2, 0.25, 0.3, 0.35, 0.38, 0.4, 0.45, 0.5, 0.55, 0.6-0.8 (0.1step)mm | 0.04, 0.045, 0.05, 0.055, 0.065, 0.075, 0.09, 0.1, 0.17mm |
Features
CCL-HL832MG / GHPL-830MG has low dielectric properties. It was developed to meet the needs of RF semiconductor subtrates.
Typical applications
Substrates for RF modules, power amplifier modules, bluethooth modules.
| Item | Condition | Unit | HL832MG | |
|---|---|---|---|---|
|
Dielectric Constant
|
1MHz
|
A
|
—
|
4.2
|
|
1GHz
|
A
|
—
|
4.0
|
|
|
Dissipation Factor
|
1MHz
|
A
|
—
|
0.006
|
|
1GHz
|
A
|
—
|
0.008
|
|
|
Insulation Resistance
|
C-96/20/65
|
Ω
|
5×1013-15
|
|
|
Surface Resistance
|
C-96/20/65
|
Ω
|
5×1014-16
|
|
|
Volume Resistivity
|
C-96/20/65
|
Ω·cm
|
5×1012-14
|
|
|
Flexural Strength
|
Warp
|
A
|
MPa
|
540
|
|
Fill
|
A
|
MPa
|
500
|
|
|
Flexural Modulus
|
Warp
|
A
|
GPa
|
23
|
|
Fill
|
A
|
GPa
|
22
|
|
|
Tensile Strength
|
Warp
|
A
|
MPa
|
350
|
|
Fill
|
A
|
MPa
|
300
|
|
|
Young’s Modulus
|
Warp
|
A
|
GPa
|
26
|
|
Fill
|
A
|
GPa
|
24
|
|
|
Glass Transition Temp.
|
DMA
|
A
|
℃
|
210
|
|
TMA
|
A
|
℃
|
180
|
|
|
Cofficent of Thermal Expansion
|
Warp, Fill
|
A
|
ppm/℃
|
15
|
|
Z
(α1, α2) |
A
|
ppm/℃
|
55/220
|
|
|
Peel Strength
|
12μ
|
A
|
KN/m
|
0.9
|
|
18μ
|
A
|
KN/m
|
1.0
|
|
|
Flame Resistance
|
UL94
|
E-168/70
|
—
|
V-0
|
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