Description
- System features
| Description | Specification |
| Ring frame cassette | 2 ports |
| Wafer capability | 6 inch & 8 inch |
| Application wafer | Glass Wafer/Silicon Wafer |
| Application tape | Normal or UV tape |
| Ring frame capability | 8 inch |
| Wafer thickness | 100 um~ |
| Wafer warpage | 4 mm~ |
| ESD | 1000V~100V, 10secs, Ion balance : +/-50V |
| Operation | 15” touch monitor, Data & GUI by PC |
| Main system control | PLC (Omron) |
| EMO switch | 4ea |
| Noise level | Max. 80dB |
| UPH | 50 frame/hr |
| Grip ring buffer | Up to 40 ea |
| Label size | 10㎜ x 50㎜ |
| Label attach position | 0°, 90°, 180° and 270° |
| Label attach position accuracy | ±1.0㎜ |
| Tape remained length after cutting | 0.5 mm ~ 1 mm |
Optional items:
1.Handy scanner
2.SECS Gem communication
3.Ultra-hepa filter
4.Wafer ID reader
Reviews
There are no reviews yet.