Description
Specification
| Application Wafer | 8” & 12” |
| Wafer Thickness | 200um (8″) |
| 300um (12″) | |
| Wafer Warpage | 4mm>= |
| Application Tape | Non UV and UV Tape |
| Main Controller | PLC |
| Data and GUI | PC |
| Tape Tension Control | Yes |
| Peel bar Temperature | 180ºC +/- 5 |
| Peeling Angle Adjustable | Yes |
| Wafer Center Accuracy | +/- 0.5 mm |
| Wafer Angle | 0,90,180,270 Deg |
| Chuck Temperature | 60ºC +/- 5ºC |
| Chuck table Material | POROUS |
| Vision Alignment | Yes |
| Chuck Surface Cleaning | Yes |
| Tape Consumption | 30~40mm |
| UV Feature | Yes |
| UPH | 8inch: 60 Wafer/Hour 12inch: 50 Wafer/Hour note: Based on UV tape @50mm/sec |
Options
|
Facility
| Power Supply | AC220V +/-10% |
| Phase | Single |
| Frequency | 50/60Hz |
| Amphere | 30A |
| Air Supply | 5.0Kgf/cm2 |
| Dimension for 12”, 8” machine | 2300x1600x1850(LxDxH) approx. 1400kg |
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