Description

Features:

• Ideal inspection for solder paste thickness, dealing with the increasingly growth of fine pitch, enhanced printing technology and high precision requirement
• Prevent virous kinds of defect from printing process, such as the bridging, deviation location, etc…
• Laser vision measurement, without contact and damage
• Statistical charts and process capability index be provided as the real-time data for quality control
• Easy to operate, fast gather the printing data for reference
• Measure printed solder thickness, height, length and interval
• Providing various kind of statistical charts, such as the distributive thickness chart, -R control chart and process capability index: Cp, Cpm ,Cpk for reference
• Analyze thickness for solder cross-section
• Inspect length and thickness for other kinds of materials

Printing For Control Chart:

• X-R control chart
• Cp, Cpk, Cpm capability index
• [Operation And Measurement]
• Display image full of screen
• Easy to sample
• Easy to operate
• Real-time appearing the statistic
• [Distributive Thickness Chart]
• Display and print the distributive thickneess chart
• Disply and print all the statistic
• Analysis the percentage for distributive thickness

Application:

• Get the results of statistics and analysis about all surveyed values in every thickness degree
• inspect the quality of solder printing process
• Survey the thickness benignancy of tin solder
• Measure the dimension of tin solder
• Provide thickness and dimension measurement function for other object