Description

Inline vision equipment for testing defects in lead frame chips and wires in ring frames loaded into cassettes.

2D Vision Inspection

• Rotation, movement, crack inspection after chip bonding
• Bending, breaking, short inspection after wire bonding

Compact Design

• 1684 (W) x 1800 (D) x 1764 (H) mm
• 25 megapixel camera
• 4.5μm telecentric lens
• 8 layers light (UV)

3D Vision Inspection (LV50SH)

• High speed-fixed density 3D laser sensor application