Description

Specification

Application ring framer : 6″, 8″ or 8″, 12”

Application tape: Non-UV/ UV tape

Wafer thickness: 200um (8″) / 330 um (12″)

Wafer warpage: 4mm >=

Tape wide: 300mm, 400mm

UPH : 40 ~ 50 wafer/hr (8″/ 12″)

Main controller : PLC

Data & GUI : PC

Blade life time : 10,000 sheets

Bonding magazine : 6ea

PCB center accuracy: +/- 0.5mm

Chuck temp : 80℃ +/-5

Wafer angle: 0′, 90′, 180′, 270′

Options (Add-Ons)

• Non-contact type chuck
• Pre-cut tape function (290mm, 390mm)
• PCB used