Description

PV11SS

Stand alone vision equipment that tests a defect in chips and wires after chip mounting and wire bonding.

2D Vision Inspection

• Rotation, movement, crack inspection after chip bonding

• Bending, breaking, short inspection after wire bonding

Design Specifications

• 800 (W) x 1500 (D) x 1650 (H)

• 12 megapixel camera

• 4μm telecentric lens

• 7 layer coaxial colour light

PV30SS

In-line vision equipment that tests a defect in chips and wires after chip mounting and wire bonding.

2D Vision Inspection

• Rotation, movement, crack inspection after chip bonding

• Bending, breaking, short inspection after wire bonding

Design Specifications

• 800 (W) x 1500 (D) x 1650 (H)

• 12 megapixel camera

• 4μm telecentric lens

• 7 layer coaxial colour light