Description

This tape is designed for surface protection of semiconductor wafers during the process. Our tape development has advanced to meet the needs of changing semiconductor packaging trends, such as reduced wafer thickness, increased WLCSP bump height and newly developed processes with customizable features in this case, double-sided to fit the need of your process.

Features

• Reduced wafer breakage during process by using shock absorbing properties of our tape.
• Less chipping
• Good detachability after UV irradiation
• Anti-static
• Lower impurities particles count
• Can endure up to 190°C/290°C in the process