Description
This wafer mounter is ideal for diversified tape application and lamination conditions.
This model meets user requirements for manual equipment that is automated for only critical application work and that allows for user-settable application conditions and quantitative control of application quality.
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Uses
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For dicing process
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For DAF (die-bonding film)
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For back grind (BG) film
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For functional film
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Features
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Automatic lamination under pre-set application conditions
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Compatible with various kinds of tapes and films
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Variable application pressure
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Variable application roller speed
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Built-in circumferential tape cutter
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Built-in horizontal tape cutter
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Built-in automatic separator reel-in mechanism
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Can be customized for non-contact surface application
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Can be customized for hot wafer chuck
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Can be customized for measures against static electricity
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Compact, light-weight, and table-top type
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