Description

Specification

Application wafer : 6″, 8″ or 8″, 12”

Cutting size: 299.7mm, 199.7mm

Application tape : LC2850 (Adwill)

UPH : 30 wafer/hr (8″),  25 wafer/hr (12″)

Main controller : PLC

Data & GUI : PC

Core life time : 60,000 sheets

Wafer center accuracy : +/-0.5mm

Bond roller temp : 80℃

Chuck temp : 100℃ +/-5

Tape thickness: 22um, 25um, 40um

Tape consumption : 30~40mm

Tape Tension Controller: Yes

Options (Add-Ons)

• FOUP Cassette
• ID Reader
• DSC & Heat Cassette (Thin wafers)
• HEPA filter
• GEM interface
• 8″ Flat-type wafers