Description

Specification

Application wafer : 6″, 8″ or 8″, 12”

Application tape : Photo resist dry film

UPH : 60 wafer/hr (8″),  55 wafer/hr (12″)

Main controller : PLC

Data & GUI : PC

Blade life time : 500 sheets

Wafer center accuracy : +/-0.5mm

Blade temp : 120℃ +/-5

Chuck temp : 100℃ +/-5

Tape consumption : 30~40mm

Wafer angle : 0′, 90’, 180’, 270’

Tape cutting angle adjustable: 70′ ~ 90′

Tape thickness: 50um

Tape width: 230mm, 250mm for 8″ / 330mm for 12″

Tape Tension Controller: Yes

Options (Add-Ons)

• Bumped wafer (30㎛ ~250 ㎛)
• DBG process
• FOUP Cassette loader
• HEPA filter
• GEM interface