Description

Specification

Application wafer : 6″, 8″ or 8″, 12”

Application tape: Non-UV & UV tape

Wafer thickness: 200 um (8″) / 330 um (12″)

Wafer warpage: 4mm >=

Tape wide: 300mm, 400mm

UPH : 40 ~ 50 wafer/hr (8″, 12″)

Main controller : PLC

Data & GUI : PC

Blade life time : 10,000 sheets

Chuck temp : 80℃ +/-5

Tape consumption : 30~40mm

Wafer angle : 0′, 90’, 180’, 270’

Options (Add-Ons)

• Non-contact type chuck
• Pre-cut tape function (290mm, 390mm)
• HEPA filter
• GEM interface